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VNN3NV04, VNS3NV04 VND3NV04, VND3NV04-1
OMNIFET II fully autoprotected Power MOSFET
Features
Type VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1

RDS(on)
Ilim
Vclamp
2
120 m
3.5 A
40 V
SOT-223
1
2
3
SO-8
Linear current limitation Thermal shutdown Short circuit protection Integrated clamp Low current drawn from input pin Diagnostic feedback through input pin ESD protection Direct access to the gate of the Power MOSFET (analog driving) Compatible with standard Power MOSFET in compliance with the 2002/95/EC European Directive
3 1
1 3 2
TO252 (DPAK)
TO251 (IPAK)
Description
The VNN3NV04, VNS3NV04, VND3NV04 VND3NV04-1, are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, intended for replacement of standard Power MOSFETs from DC up to 50 kHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin.
Table 1.
Package
Device summary
Order codes Tube Tube (lead-free) VND3NV04-E VND3NV04-1-E Tape and reel VNN3NV0413TR VNS3NV0413TR VND3NV0413TR Tape and reel (lead-free) VND3NV04TR-E -
SOT-223 SO-8 TO-252 TO-251
VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1
April 2009
Doc ID 7382 Rev 2
1/26
www.st.com 1
Contents
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Contents
1 2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 2.2 2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TO-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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List of figures
Device name or AN #
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal impedance for DPAK/IPAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal impedance for SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Static drain-source on resistance vs input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Static drain-source on resistance vs input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Static drain-source on resistance vs Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off drain source voltage slope (part 2/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Switching time resistive load (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Switching time resistive load (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Normalized current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 TO-251 (IPAK) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 TO-252 (DPAK) package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 SOT-223 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SOT-223 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-8 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DPAK footprint and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DPAK tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Block diagram and pin description
1
Block diagram and pin description
Figure 1. Block diagram
DRAIN
2 Overvoltage Clamp
INPUT
1
Gate Control
Over Temperature
Linear Current Limiter
3
SOURCE
FC01000
Figure 2.
Configuration diagram (top view)
SO-8 Package(1)
SOURCE SOURCE SOURCE INPUT
1
8
DRAIN DRAIN DRAIN
4
5
DRAIN
1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1.
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Electrical specifications
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
2
Electrical specifications
Figure 3. Current and voltage conventions
ID VDS
DRAIN IIN RIN INPUT SOURCE
VIN
2.1
Absolute maximum ratings
Table 2.
Symbol VDS VIN IIN RIN MIN ID IR VESD1 VESD2 Ptot Tj Tc Tstg
Absolute maximum ratings
Value Parameter SOT-223 Drain-source voltage (VIN=0 V) Input voltage Input current Minimum input series impedance Drain current Reverse DC output current Electrostatic discharge (R=1.5 K, C=100 pF) Electrostatic discharge on output pin only (R=330 , C=150 pF) Total dissipation at Tc=25 C Operating junction temperature Case operating temperature Storage temperature 7 SO-8 DPAK/IPAK V V mA W A A V V 35 W C C C Internally clamped Internally clamped +/-20 220 Internally limited -5.5 4000 16500 8.3 Internally limited Internally limited -55 to 150 Unit
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Electrical specifications
2.2
Table 3.
Symbol Rthj-case Rthj-lead Rthj-amb
Thermal data
Thermal data
Value Parameter SOT-223 Thermal resistance junction-case max Thermal resistance junction-lead max Thermal resistance junction-ambient max 70
(1)
Unit SO-8 DPAK 3.5 15 65
(1)
IPAK 3.5 C/W C/W
18
54
(1)
100
C/W
1. When mounted on a standard single-sided FR4 board with 50 mm2 of Cu (at least 35 mm thick) connected to all DRAIN pins.
2.3
Table 4.
Symbol Off VCLAMP VCLTH VINTH IISS VINCL IDSS On RDS(on)
Electrical characteristics
-40 C < Tj < 150 C, unless otherwise specified. Electrical characteristics
Parameter Test conditions Min Typ Max Unit
Drain-source clamp voltage Drain-source clamp threshold voltage Input threshold voltage
VIN=0 V; ID=1.5 A VIN=0 V; ID=2 mA VDS=VIN; ID=1 mA
40 36 0.5
45
55
V V
2.5 100 150 8 -0.3 30 75
V A V A
Supply current from input VDS=0 V; VIN=5 V pin Input-source clamp voltage Zero input voltage drain current (VIN=0 V) IIN=1 mA IIN=-1 mA VDS=13 V; VIN=0 V; Tj=25 C VDS=25 V; VIN=0 V 6 -1.0
6.8
Static drain-source on resistance
VIN=5 V; ID=1.5 A; Tj=25 C VIN=5 V; ID=1.5 A
120 240
m
Dynamic (Tj=25 C, unless otherwise specified) gfs (1) COSS Forward transconductance Output capacitance VDD=13 V; ID=1.5 A VDS=13 V; f=1 MHz; VIN=0 V 5.0 150 S pF
Switching (Tj=25 C, unless otherwise specified)
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Electrical specifications Table 4.
Symbol td(on) tr td(off) tf td(on) tr td(off) tf (dI/dt)on Qi
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Electrical characteristics (continued)
Parameter Turn-on delay time Rise time Turn-off delay time Fall time Turn-on delay time Rise time Turn-off delay time Fall time Turn-on current slope Total input charge VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=RIN MIN=220 VDD=12 V; ID=1.5 A; VIN=5 V Igen=2.13 mA (see figure Figure 7.) VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=2.2 K (see figure Figure 4.) VDD=15 V; ID=1.5 A Vgen=5 V; Rgen=RIN MIN=220 (see figure Figure 4.) Test conditions Min Typ 90 250 450 250 0.45 2.5 3.3 2.0 4.7 8.5 Max 300 750 1350 750 1.35 7.5 10.0 6.0 Unit ns ns ns ns s s s s A/s nC
Source drain diode (Tj=25 C, unless otherwise specified) VSD(1) trr Qrr IRRM Forward on voltage Reverse recovery time ISD=1.5 A; VIN=0 V 0.8 107 37 0.7 V ns C A
ISD=1.5 A; dI/dt=12 A/s Reverse recovery charge VDD=30 V; L=200 H Reverse recovery current (see test circuit, figure Figure 5.)
Protections (-40 C < Tj < 150 C, unless otherwise specified) Ilim tdlim Tjsh Tjrs Igf Eas Drain current limit Step response current limit Over temperature shutdown Over temperature reset Fault sink current Single pulse avalanche energy VIN=5 V; VDS=13 V; Tj=Tjsh starting Tj=25C; VDD=24 V VIN=5 V Rgen=RIN MIN=220 ; L=24 mH (see figures Figure 6. & Figure 8.) VIN=5 V; VDS=13 V VIN=5 V; VDS=13 V 150 135 10 100 15 20 3.5 5 10 175 200 7 A s C C mA mJ
1. Pulsed: Pulse duration = 300 s, duty cycle 1.5 %
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Protection features
3
Protection features
During normal operation, the input pin is electrically connected to the gate of the internal Power MOSFET through a low impedance path. The device then behaves like a standard Power MOSFET and can be used as a switch from DC up to 50 kHz. The only difference from the user's standpoint is that a small DC current IISS (typ. 100A) flows into the input pin in order to supply the internal circuitry. The device integrates:
Overvoltage clamp protection: internally set at 45 V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads. Linear current limiter circuit: limits the drain current ID to Ilim whatever the input pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the over temperature threshold Tjsh. Over temperature and short circuit protection: these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Over temperature cutout occurs in the range 150 to 190 C, a typical value being 170 C. The device is automatically restarted when the chip temperature falls of about 15 C below shutdown temperature. Status feedback: in the case of an over temperature fault condition (Tj > Tjsh), the device tries to sink a diagnostic current Igf through the input pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the input pin driver is not able to supply the current Igf, the input pin will fall to 0 V. This will not however affect the device operation: no requirement is put on the current capability of the input pin driver except to be able to supply the normal operation drive current IISS.
Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL logic circuit.
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Protection features Figure 4.
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Switching time test circuit for resistive load
VD
ID
Rgen Vgen
90%
tr td(on)
10% td(off)
tf t
Vgen
t
Figure 5.
Test circuit for diode recovery times
A D I
FAST DIODE
A L=100uH B D
OMNIFET
S B
220 Rgen
I
VDD
OMNIFET
S
Vgen
8.5
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Protection features
Figure 6.
Unclamped inductive load test circuits
Figure 7.
Input charge test circuit
Figure 8.
Unclamped inductive waveforms
VIN
GEN
ND8003
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Protection features
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
3.1
Figure 9.
Electrical characteristics curves
Thermal impedance for DPAK/IPAK Figure 10. Thermal impedance for SOT-223
Figure 11.
Derating curve
Figure 12. Transconductance
Gfs (S)
11 10 9 8 7 6 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vds=13V
Tj=-40C Tj=25C Tj=150C
Id (A)
Figure 13. Static drain-source on resistance vs input voltage (part 1/2)
Rds(on) (mohms)
300 275 250 225 200 175 150 125 100 75 50 25 0 3 3.5 4 4.5 5 5.5 6 6.5
Id=3.5A Id=1A
Figure 14. Static drain-source on resistance vs input voltage (part 2/2)
Rds(on) (mohms)
250 225 200
Id=1.5A
Tj=150C
175 150 125
Tj=150C
Tj=25C Tj=-40C
Id=3.5A Id=1A Id=3.5A Id=1A
100 75 50 25 0 3 3.5 4 4.5 5 5.5 6 6.5
Tj=25C Tj=-40C
Vin(V)
Vin(V)
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Protection features
Figure 15. Source-drain diode forward characteristics
Vsd (mV)
1100 1050 1000 950
Figure 16. Static drain source on resistance
Rds(on) (ohms)
4.5
Tj=-40C
Vin=0V
4 3.5 3
Vin=2.5V
900 850 800 750 700 650 600 0 1 2 3 4 5 6 7 8 9 10 11 12
2.5 2 1.5 1 0.5 0 0 0.05 0.1 0.15 0.2 0.25 0.3
Tj=25C Tj=150C
Id (A)
Id(A)
Figure 17. Turn-on current slope (part 1/2)
di/dt(A/us)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500
Figure 18. Turn-on current slope (part 2/2)
di/dt(A/usec)
1.75 1.5 1.25 1 0.75 0.5 0.25 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500
Vin=5V Vdd=15V Id=1.5A
Vin=3.5V Vdd=15V Id=1.5A
Rg(ohm)
Rg(ohm)
Figure 19. Transfer characteristics
Figure 20. Static drain-source on resistance vs Id
Rds(on) (mohms)
250
Tj=25C
Idon(A)
2.25 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0 1.5 1.75 2 2.25 2.5 2.75 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5
225 200 175 150 125
Vds=13.5V
Vin=5V
Tj=150C
Tj=150C Tj=-40C
100 75 50 25 0 0 0.5 1 1.5 2 2.5
Tj=25C
Tj= - 40C
Vin(V)
3
3.5
4
Id (A)
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Protection features
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Figure 21. Input voltage vs input charge
Figure 22. Turn-off drain source voltage slope (part 1/2)
dv/dt(V/usec)
300 275
Vin (V)
6
5
250
Vds=12V Id=0.5A
4
225 200 175
Vin=5V Vdd=15V Id=1.5A
3
150 125
2
100 75
1
50 25 0 0 500 250 750 1000 1250 1500 1750 2000 2250 2500
0 0 1 2 3 4 5 6
Qg (nC)
Rg(ohm)
Figure 23. Turn-off drain source voltage slope Figure 24. Capacitance variations (part 2/2)
dv/dt(V/usec)
300 275 250 225 200 175 150 125 100 75 50 25 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500
50 0 5 10 15 20 25 30 35 100 150 200
C(pF)
350
Vin=3.5V Vdd=15V Id=1.5A
300
f=1MHz Vin=0V
250
Rg(ohm)
Vds(V)
Figure 25. Output characteristics
Figure 26. Normalized on resistance vs temperature
v
Id (A)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10
Vin=5V Vin=4V
Rds(on) (mOhm)
4 3.5 3
Vin=3V
Vin=5V Id=1.5A
2.5 2 1.5 1 0.5 -50 -25 0 25 50 75 100 125 150 175
Vds (V)
Tc )C)
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Protection features
Figure 27. Switching time resistive load (part 1/2)
Figure 28. Switching time resistive load (part 2/2)
t(usec)
4 3.5 3 2.5 2
t(nsec)
900
Vdd=15V Id=1.5A Vin=5V
td(off) tr
800
tr
700 600 500
Vdd=15V Id=1.5A Rg=220ohm
tf
1.5 1 0.5 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500
400
td(off)
300
td(on)
200 100 0 3.25
tf td(on)
Rg(ohm)
3.5
3.75
4
4.25
4.5
4.75
5
5.25
Vin(V)
Figure 29. Normalized input threshold voltage Figure 30. Normalized current limit vs junction vs temperature temperature
Ilim (A)
Vinth (V)
2
10 9
1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2
Vds=Vin Id=1mA
8 7 6 5 4 3 2 1
Vin=5V Vds=13V
0 -50 -25 0 25 50 75 100 125 150 175
0 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C)
Figure 31. Step response current limit
Tdlim(usec)
13 12.5 12 11.5 11 10.5 10 9.5 9 8.5 8 7.5 5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vin=5V Rg=220ohm
Vdd(V)
Doc ID 7382 Rev 2
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Package and packing information
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4
Package and packing information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark.
4.1
TO-251 (IPAK) mechanical data
Table 5. TO-251 (IPAK) mechanical data
millimeters Symbol Min. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 2.2 0.9 0.7 0.64 5.2 Typ. Max. 2.4 1.1 1.3 0.9 5.4 0.85
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Figure 32. TO-251 (IPAK) package dimensions
Package and packing information
4.2
TO-252 (DPAK) mechanical data
Table 6. TO-252 (DPAK) mechanical data
millimeters Symbol Min. A A1 A2 B B2 C C2 D D1 E E1 e G H 4.40 9.35 6.40 4.7 2.28 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 5.1 6.60 Typ. Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20
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Package and packing information Table 6.
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
TO-252 (DPAK) mechanical data (continued)
millimeters
Symbol Min. L2 L4 R V2 Package Weight 0 0.60 0.2 8 Gr. 0.29 Typ. 0.8 1.00 Max.
Figure 33. TO-252 (DPAK) package dimensions
P032P
4.3
SOT-223 mechanical data
Table 7. SOT-223 mechanical data
millimeters Symbol Min. A B B1 c D e 0.6 2.9 0.24 6.3 0.7 3 0.26 6.5 2.3 Typ. Max. 1.8 0.85 3.15 0.35 6.7
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Table 7. SOT-223 mechanical data (continued)
Package and packing information
millimeters Symbol Min. e1 E H V A1 0.02 3.3 6.7 Typ. 4.6 3.5 7 10 (max) 0.1 3.7 7.3 Max.
Figure 34. SOT-223 package dimensions
0046067
4.4
SO-8 mechanical data
Table 8. SO-8 mechanical data
millimeters Symbol Min A a1 a2 a3 b A A1 0.10 0.65 0.35 0.1 Typ Max 1.75 0.25 1.65 0.85 0.48 1.75 0.25
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Package and packing information Table 8.
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
SO-8 mechanical data (continued)
millimeters
Symbol Min A2 b c D
(1)
Typ
Max
1.25 0.28 0.17 4.80 5.80 3.80 4.90 6.00 3.90 1.27 0.25 0.40 1.04 0 8 0.10 0.50 1.27 0.48 0.23 5.00 6.20 4.00
E E1(2) e h L L1 k ccc
1. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm in total (both side). 2. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side.
Figure 35. SO-8 package dimensions
0016023 D
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Package and packing information
4.5
SOT-223 packing information
Figure 36. SOT-223 tape and reel shipment (suffix "TR")
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 12.4 60 18.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 12 4 8 1.5 1.5 5.5 4.5 2
All dimensions are in mm.
End
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
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Package and packing information
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4.6
SO-8 packing information
Figure 37. SO-8 tube shipment (no suffix)
B C
A
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
100 2000 532 3.2 6 0.6
Figure 38. SO-8 tape and reel shipment (suffix "TR")
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 12 4 8 1.5 1.5 5.5 4.5 2
End
All dimensions are in mm.
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Package and packing information
4.7
DPAK packing information
Figure 39. DPAK footprint and tube shipment (no suffix)
A
6 .7
1 .8
3 .0
1 .6
C
2 .3 6 .7 2 .3
B
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
75 3000 532 6 21.3 0.6
Figure 40. DPAK tape and reel shipment (suffix "TR")
REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 8 1.5 1.5 7.5 6.5 2
All dimensions are in mm.
End
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
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Package and packing information
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4.8
IPAK packing information
Figure 41. IPAK tube shipment (no suffix)
A C
B
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
75 3000 532 6 21.3 0.6
All dimensions are in mm.
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Doc ID 7382 Rev 2
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
Revision history
5
Revision history
Table 9.
Date 01-Feb-2003 27-Apr-2009
Document revision history
Revision 1 2 Initial Release Added Table 1: Device summary on page 1 Updated Table 4: Package and packing information on page 16 Changes
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VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
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